dependency testing
Classification
Subject
Condition
Testing equipment
Sample
Failure %
Durability test
Room-temperature operation life (RTOL)
T=(25 ± 3)oC
RH=(50 ± 10)%
IF=20, 30 or 50mA
Check point: 0,168,500,1000hr
RH=(50 ± 10)%
IF=20, 30 or 50mA
Check point: 0,168,500,1000hr
Burn-in board
22
0
High-temperature & high-humidity storage life(HTHHSL)
T=(85 ± 5)oC
RH= 85%
Check point: 0,1000hr
RH= 85%
Check point: 0,1000hr
Environmental
testing chamber
testing chamber
22
0
Temperature-humidity-bias (THB)
T=(85 ± 5)oC
RH=85%
VR=5V
Check point: 0,1000hr
RH=85%
VR=5V
Check point: 0,1000hr
Environmental
testing chamber
testing chamber
22
0
High-temperature storage life (HTSL)
T=(100 ± 5)oC
Check point: 0,1000hr
Check point: 0,1000hr
Oven
22
0
Low-temperature storage life (LTSL)
T=(-40 ± 5)oC
Check point: 0,1000hr
Check point: 0,1000hr
Environmental
testing chamber
testing chamber
22
0
Environmental experiment
Temperature cycling (TC)
(-40 ± 5)oC ~ (100 ± 5)oC
Duration: 30, 5, 30, 5min
Cycle: 0, 100
Duration: 30, 5, 30, 5min
Cycle: 0, 100
Environmental
testing chamber
testing chamber
22
0
Thermal shock (TS)
(-40 ± 5)oC ~ (100 ± 5)oC
Duration: 30min
Cycle: 0, 100
Duration: 30min
Cycle: 0, 100
Thermal shock tester
22
0
Reflow soldering (RS)
T=260 ± 5oC
Dwell time=10sec
Testing=5 times
Dwell time=10sec
Testing=5 times
Reflow oven
22
0
Bath soldering (BS)
T=260 ± 3oC
Dwell time=10sec
Dwell time=10sec
Soldering bath
22
0